To provide an IC card manufacturing method for obtaining an IC card with excellent quality without any crack on the cross section of the IC card when manufacturing the IC card by punching with a punch and a die.
The IC card manufacturing method is designed for manufacturing the IC card with an IC module enclosed between a first sheet having an image formable image reception layer and a second sheet having a writable writing layer, by punching with the use of the die having a hole part with the shape of the IC card and the removable punch to be fitted to the hole part of the die. The first sheet having the elastic modulus of 100-200 N/mm2 at ordinary temperature is positioned on the side of the die. The second sheet having the elastic modulus of 1,000-5,000 N/mm2 at ordinary temperature is positioned on the side of the punch. Then, the IC card is punched.
KONICA MINOLTA MED & GRAPHIC
| JPH11216973A | 1999-08-10 | |||
| JP2002245423A | 2002-08-30 | |||
| JPH11314480A | 1999-11-16 | |||
| JPH11333799A | 1999-12-07 | |||
| JP2002352213A | 2002-12-06 | |||
| JP2001256462A | 2001-09-21 | |||
| JPH0740690A | 1995-02-10 |
Hiroyuki Nagai
Junpei Okada
Hirohito Katsunuma
Hiroyuki Ohno