Title:
METHOD FOR MANUFACTURING INSULATING RESIN WITH COPPER FOIL
Document Type and Number:
Japanese Patent JP2002225182
Kind Code:
A
Abstract:
To provide a method for manufacturing an insulating resin with a copper foil of less generation amount of a resin powder.
The insulating resin with the copper foil is manufactured through a process such that an insulating resin layer is formed on the single surface of the copper foil to form the insulating resin with the copper foil which is, in turn, cut into a necessary size and at least the cut of the insulating resin with the copper foil is treated with a liquid not dissolving the insulating resin with the copper foil.
Inventors:
OHASHI KENICHI
FUKAI HIROYUKI
FUKAI HIROYUKI
Application Number:
JP2001025652A
Publication Date:
August 14, 2002
Filing Date:
February 01, 2001
Export Citation:
Assignee:
HITACHI CHEMICAL CO LTD
International Classes:
B32B15/08; H05K3/00; H05K3/26; (IPC1-7): B32B15/08; H05K3/00; H05K3/26
Domestic Patent References:
| JPH11348177A | 1999-12-21 | |||
| JPH03225996A | 1991-10-04 |