Title:
METHOD OF MANUFACTURING LASER IRRADIATION EQUIPMENT AND SEMICONDUCTOR DEVICE
Document Type and Number:
Japanese Patent JP2004165184
Kind Code:
A
Abstract:
To solve the problem wherein a device for shielding a laser beam in accordance with the movement of a scanning stage is provided so as to enable the laser beam to irradiate only a substrate, but the irradiation traces of the laser beam left on the substrate become not rectilinear but wavy reflecting on vibrations when the vibrations of the device are conducted to an optical system that forms a beam spot and the scanning stage where the substrate is installed.
Laser irradiation equipment employs a shutter which uses as a power source a motor whose rotational acceleration change is continuous, so that vibrations originating from the shutter can be eliminated, and the irradiation traces of the laser beam on the substrate become rectilinear.
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Inventors:
MORIWAKA TOMOAKI
Application Number:
JP2002325661A
Publication Date:
June 10, 2004
Filing Date:
November 08, 2002
Export Citation:
Assignee:
SEMICONDUCTOR ENERGY LAB
International Classes:
H01L21/20; H01L21/268; H01L21/336; H01L29/786; (IPC1-7): H01L21/268; H01L21/20; H01L21/336; H01L29/786