Title:
ケイ素含有封入材を有する発光デバイスの製造方法
Document Type and Number:
Japanese Patent JP2008521252
Kind Code:
A
Abstract:
A method of making a light emitting device is disclosed. The method includes the steps of providing a light emitting diode and forming an encapsulant in contact with the light emitting diode; wherein forming the encapsulant includes contacting the light emitting diode with a photopolymerizable composition consisting of a silicon-containing resin and a metal-containing catalyst, wherein the silicon-containing resin consists of silicon-bonded hydrogen and aliphatic unsaturation, and applying actinic radiation having a wavelength of 700 nm or less to initiate hydrosilylation within the silicon-containing resin.
Inventors:
Boardman, Larry Dee.
Thompson, Dee. Scott
Leatherdale, Catherine A.
Order Kirk, Andrew Jay.
Thompson, Dee. Scott
Leatherdale, Catherine A.
Order Kirk, Andrew Jay.
Application Number:
JP2007543144A
Publication Date:
June 19, 2008
Filing Date:
November 14, 2005
Export Citation:
Assignee:
3M INNOVATIVE PROPERTIES COMPANY
International Classes:
C08K5/56; C08L83/05; C08L83/07; H01L33/56
Domestic Patent References:
| JP2003155378A | 2003-05-27 | |||
| JP2005158762A | 2005-06-16 | |||
| JP2002338833A | 2002-11-27 | |||
| JP2005072552A | 2005-03-17 | |||
| JPH0563241A | 1993-03-12 | |||
| JPS62294239A | 1987-12-21 | |||
| JP2001089491A | 2001-04-03 | |||
| JPS60139756A | 1985-07-24 |
Attorney, Agent or Firm:
Atsushi Aoki
Takashi Ishida
Tetsuji Koga
Nagasaka Tomoyasu
Takashi Ishida
Tetsuji Koga
Nagasaka Tomoyasu