To solve the problem, wherein the manufacturing cost of a liquid crystal display device having an organic inter-layer insulating film is increased by the need for performing a photolithographic process twice, because when formation of a contact hole and opening of the seal part are performed in a single process, gate wiring of the sealing part is exposed, to cause reduction in the adhesive strength between a sealing material and the gate wiring due to the corrosion of wiring materials.
A method of manufacturing a liquid crystal display device which includes a first substrate having a pixel part, where thin-film transistors are formed and the sealing part disposed in the periphery of the pixel part, a second substrate facing the first substrate, and a liquid crystal layer filled between the first substrate and the second substrate, and in which the first substrate and the second substrate are bonded together by the sealing material provided to the seal part, includes a step of forming a semiconductor layer, constituting the thin film transistors and a step of forming a semiconductor connection layer made of the same material as the semiconductor layer, in the sealing part. These steps are performed simultaneously.
MATSUNO FUMIHIKO
JP2003167258A | 2003-06-13 | |||
JP2000347173A | 2000-12-15 | |||
JP2002328395A | 2002-11-15 | |||
JP2000347173A | 2000-12-15 | |||
JP2003167258A | 2003-06-13 | |||
JP2002328395A | 2002-11-15 |
Akitaka Kimura
Toshio Asai
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