Title:
METHOD FOR MANUFACTURING MICROSTRUCTURE AND METHOD FOR ASSEMBLING MICROSTRUCTURE ONTO SUBSTRATE
Document Type and Number:
Japanese Patent JP3828567
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To provide an assembly method that enables the assembly of a microstructure onto a substrate through a fluid carrier.
SOLUTION: The microstructure is a building block 19, such as a gallium arsenide block, which aligns itself at a dent 55 on a silicon substrate 50 such that it is integrated with it. The method includes a step that carries a building block 19 into a fluid to build a slurry. Then, it uniformly pours the slurry onto the top surface 53 of the substrate with the dent on its surface. The microstructure rolls over the substrate surface due to its shape and fluid to fit into the dent for self-alignment.
Inventors:
Smith, John S.
You, Hi-Jen Jay.
You, Hi-Jen Jay.
Application Number:
JP2005293820A
Publication Date:
October 04, 2006
Filing Date:
October 06, 2005
Export Citation:
Assignee:
The Regents of The University of California
International Classes:
H01L21/302; B65G49/02; H01L21/52; G02F1/1362; H01L21/02; H01L21/306; H01L21/3065; H01L21/50; H01L21/58; H01L21/677; H01L21/68; H01L21/78; H01L21/98; H01L23/13; H01L23/14; H01L25/04; H01L25/065; H01L25/075; H01L25/16; H01L27/12; H01L29/06; H01L29/88; G02F1/136; G02F1/1368; H01L33/20; H01S5/022; H01S5/40
Domestic Patent References:
| JP59004088A |
Attorney, Agent or Firm:
Takashi Ishida
Masaya Nishiyama
Masaya Nishiyama