To enable excellent process with high precision without increasing energy of a laser in a method for manufacturing a multilayer printed wiring board for processing a via hole bore using the laser.

A through hole having a larger diameter than a via hole bore 36 is drilled in a preimpregnation 10, and the other insulation substrate 16 is stacked on one face of the preimpregnation 10 so that its circuit pattern 34 faces a through hole, to be thermocompressed. Thereafter, a via hole bore 30 having a smaller diameter than the through hole is processed using laser from the other face of the preimpregnation 10, and this via hole bore 30 is performed copper plating to form the via hole 36.