Title:
METHOD FOR MANUFACTURING PARTICLE BOARD
Document Type and Number:
Japanese Patent JP2002046113
Kind Code:
A
Abstract:
To provide a method for manufacturing a particle board having no contamination and the like caused by an alkali to the particle board obtained by a process for manufacturing the particle board by using a phenolic resin using the alkali.
Just before blowing an alkali phenolic resin adhesive wherein an alkali is used as a catalyst on wood chips, an aqueous melamine resin adhesive or a melamine and urea resin adhesive of ≤10% in an urea content is mixed in the alkali phenolic resin adhesive as it is within a range of 10%-30% by wt. Thereafter it is blown on the wood chips, formed into a mat and it is hot rolled.
Inventors:
MASAFUDA HAJIME
Application Number:
JP2000233876A
Publication Date:
February 12, 2002
Filing Date:
August 02, 2000
Export Citation:
Assignee:
DANTANI PLYWOOD CO
International Classes:
B27N3/08; B27N1/02; B29C43/02; C09J5/00; C09J161/06; C09J161/28; (IPC1-7): B27N3/08; B27N1/02; B29C43/02; C09J5/00; C09J161/06; C09J161/28