METHOD FOR MANUFACTURING QUARTZ OSCILLATOR CHIP, AND QUARTZ DEVICE

Japanese Patent JP3903697

B2

PROBLEM TO BE SOLVED: To provide a method for manufacturing a quartz oscillator chip, that can sufficiently diffuse and mixe high-melting point metal components into an electrode film to prevent degradation of oscillation characteristics, and a quartz device using the above characterized quartz oscillator chip.
SOLUTION: In the quartz crystal oscillator chip, an exciting electrode 19 by which a driving voltage is applied to the surface of a quartz crystal piece 21, and connecting electrodes 13 and 14 which are connected to the exciting electrode via extraction electrodes 13a and 14a, are provided, and a feeder electrode 17a for applying a driving voltage from the outside is connected to the connecting electrodes. First, the quartz crystal piece is formed from a quartz block, and on the surface of the quartz crystal piece an electrode film 25 consisting of an underlying layer 22 using a high-melting point metal, and above the underlying layer an intermediate layer 23 constructed of a mixture layer of the high-melting point metal and a conductive metal, and above the intermediate layer 23 an upper-layer 24 constructed of the conductive metal, is provided. The feeding electrode is abutted on the connecting electrode of the electrode film and soldered, then heat-treated.

Tetsuo Nakagawa
Takanori Niwa

JP2000237088A

April 11, 2007

August 04, 2000

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Seiko Epson Corporation

H03H3/04; H03H9/19; (IPC1-7): H03H3/04; H03H9/19

JP57103418A
JP59191916A
JP9093075A
JP53090793A
JP63219181A

Masahiko Ueyanagi
Osamu Suzawa

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