Title:
樹脂組成物、接着フィルムおよびコアレス基板の製造方法
Document Type and Number:
Japanese Patent JP6750202
Kind Code:
B2
Abstract:
To provide a resin composition capable of forming an insulation layer having excellent workability during the polishing and grinding step and excellent adhesion reliability. There is provided a resin composition which comprises (A) an epoxy resin, (B) a curing agent and (C) an inorganic filler, wherein the Vickers hardness of (HV1) of a resin composition cured by heating at 180 DEG C for 30 minutes satisfies the expression (i): 40 < HV1 < 220, the relation between HV1 and the Vickers hardness of (HV2) of a resin composition cured by heating at 180 DEG C for 90 minutes satisfies the expression (ii): 1 < HV2/HV1 < 1.5 and a resin composition cured by heating at 180 DEG C for 90 minutes has a glass transition temperature of 140 DEG C or more.
Inventors:
Hiroyuki Sakauchi
Mako Genjin
Mako Genjin
Application Number:
JP2015202773A
Publication Date:
September 02, 2020
Filing Date:
October 14, 2015
Export Citation:
Assignee:
AJINOMOTO CO.,LTD.
International Classes:
C08L63/00; B32B27/38; C08G73/10; C08K3/00; C08L79/08; C08L101/00; C09J11/04; C09J11/06; C09J163/00; C09J179/08; C09J201/00; H05K1/03; H05K3/20
Domestic Patent References:
| JP2014095047A | ||||
| JP2006037083A | ||||
| JP2015059170A |
Attorney, Agent or Firm:
Takashima Ichi
Kyoko Doi
Mitsunori Kamata
Yaeko Tamura
Murata Miyuki
Junzo Koike
Hirofumi Toma
Shigehisa Takayama
Kyoko Doi
Mitsunori Kamata
Yaeko Tamura
Murata Miyuki
Junzo Koike
Hirofumi Toma
Shigehisa Takayama