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Patent Searching and Data


Title:
METHOD FOR MANUFACTURING RESIN COMPOSITION MOLDING
Document Type and Number:
Japanese Patent JP2007260990
Kind Code:
A
Abstract:

To provide a method for manufacturing a resin composition molding which can be molded in a short time, namely, with favorable productivity, and has heat resistance and mechanical characteristics equivalent or superior to those of a conventional thermoplastic resin without being subjected to heat treatment (annealing).

A resin composition 8 is injected into the cavity 6 of a mold 1 the temperature of which is set properly and then the resin composition 8 is crystallized in the mold, to mold it into the resin composition molding 9. After the molding, a movable mold 3 is moved to open the mold 1. The molding 9 is taken by the movable mold 3. Next, gas is ejected by the use of an air gun nozzle 10 to a part corresponding to an ejector pin of a surface 11 exposed to the fixed mold 2 side of the molding 9 taken by the movable mold 3 to cool the part. After the cooling, the molding 9 is ejected by the ejector pin 5 and is taken out of the movable mold 3.

COPYRIGHT: (C)2008,JPO&INPIT


Inventors:
SUGAWARA AKIRA
UENO AKIRA
Application Number:
JP2006086733A
Publication Date:
October 11, 2007
Filing Date:
March 27, 2006
Export Citation:
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Assignee:
MATSUSHITA ELECTRIC WORKS LTD
International Classes:
B29C45/40; B29C45/72; B29K67/00; B29K105/16; B29K201/00
Attorney, Agent or Firm:
Toshio Nishizawa