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Patent Searching and Data


Title:
METHOD FOR MANUFACTURING RESIN MOLDED OBJECT
Document Type and Number:
Japanese Patent JP2011167901
Kind Code:
A
Abstract:

To provide a method for manufacturing a resin molded object, with favorable operating efficiency, which has excellent designability and surface hardness, and is improved in the strength and impact resistance.

This method for manufacturing a resin molded object is for molding a resin composition 1 containing a heat-curable resin 11 and a filler 12. That is, a material with a larger specific gravity than the heat-curable resin 11 as the filler 12, is used, and the filler 12 is made to precipitate by heating the resin composition at a lower temperature than the curing temperature and keeping the melt viscosity of the heat-curable resin 11 low. After that, the curing reaction is terminated to obtain a resin molded object A, and at the same time, designability is imparted to the resin molded object A by a surface resin layer 2 containing the filler 12 which is unevenly distributed by the precipitation of the surface of the resin molded object A. Further, preferably the filler 12 is composed of a particle-like mineral with the specific gravity of not less than 3.


Inventors:
MORITA SEISHI
IBI HIDEMI
Application Number:
JP2010033130A
Publication Date:
September 01, 2011
Filing Date:
February 18, 2010
Export Citation:
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Assignee:
PANASONIC ELEC WORKS CO LTD
International Classes:
B29C39/02; B29K101/10; B29K105/16