To provide a method for manufacturing a sapphire substrate capable of shortening a manufacturing step and reducing a manufacturing cost by easily and quickly reducing unevenness of thickness of the sapphire substrate and a processing amount, and to provide the sapphire substrate.

A method for manufacturing a sapphire substrate by applying processing covering a plurality of steps to a substrate obtained by slicing a sapphire ingot includes the steps of: grinding one or both sides of a substrate 10; processing the one or both sides of the ground substrate 10 by wet blasting after the grinding step; lapping the one or both sides of the substrate 10 processed by wet blasting after the wet blasting step; and polishing the one or both sides of the lapped substrate 10 by CMP after the lapping step.