Title:
METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE AND TRAY USED THEREIN
Document Type and Number:
Japanese Patent JP2002002871
Kind Code:
A
Abstract:
To enhance the protectiveness of a semiconductor device not only to prevent the destruction of a semiconductor chip but also to reduce the deformation of a tray.
The tray consists of the tray main body part 1d for connecting a plurality of pockets 1a and the cushioning part 1g provided to the bottom parts 1c of the pockets 1a being the contact places with CSPs 2 when the CSPs 2 are housed in the pockets 1a and formed from a soft material of which the hardness is lower than that of the tray main body part 1d and the impact force to the CSPs 2 at the time of falling of the tray is relieved to prevent the distruction or damage of the CSPs 2.
Inventors:
NUMAZAKI MASAHITO
ENOMOTO USUKE
SUZUKI HIROMICHI
KAZAMA HITOSHI
ENOMOTO USUKE
SUZUKI HIROMICHI
KAZAMA HITOSHI
Application Number:
JP2001079833A
Publication Date:
January 09, 2002
Filing Date:
March 21, 2001
Export Citation:
Assignee:
HITACHI LTD
HITACHI ULSI SYS CO LTD
HITACHI ULSI SYS CO LTD
International Classes:
B65D21/02; B65D85/86; B65G1/00; B65G57/00; H01L21/673; H01L23/12; (IPC1-7): B65D85/86; B65D21/02; B65G1/00; B65G57/00; H01L21/68; H01L23/12
Attorney, Agent or Firm:
Yamato Tsutsui