To provide a method of manufacturing a semiconductor element substrate expanding a transfer object region by a simple method, and improving transfer accuracy.
The method of manufacturing a semiconductor element substrate includes: a drawing process of drawing a seal material 103 of a first viscosity in a frame-like form on a transfer source substrate 100 formed with a semiconductor element; an application process of applying, in the frame of the seal material 103, an adhesive 104 having a nature similar to that of the seal material 103 and having a second viscosity lower than the first viscosity; a sticking process of sticking a first transfer destination substrate 200 to the adhesive 104 application surface of the transfer source substrate 100; and a transfer process of transferring the semiconductor element from the transfer source substrate 100 to the first transfer destination substrate 200.
Osamu Suzawa
Kazuhiko Miyasaka
Next Patent: PHOTOELECTRIC CONVERSION ELEMENT