To provide a method of manufacturing a laminate structure consisting of a wafer 11 and a transparent glass board 12 such as a chip size packaged solid-state imaging device, with good productivity and high positioning accuracy.

Many solid-state imaging elements 11A are formed on the front surface of the wafer 11 while at the same time frame-like spacers 13 having such a shape as to surround individual solid-state imaging elements and having a prescribed thickness are formed on the bottom face of the transparent glass board 12, so as to correspond to individual solid-state imaging elements. The wafer and the transparent glass board are faced and aligned, and then are fastened to each other via an adhesive 15 arranged at several spots between the wafer and the transparent glass board. Next, the wafer and the transparent glass board are joined together via the spacers, and then the joined wafer and transparent glass board is divided into individual solid-state imaging devices 21.