To reduce generation of electrostatic coupling via a peeling layer, for example, between an electrode pad and a thin film element.

In a method of manufacturing a substrate for an electrooptical device, the substrate for the electrooptical device is manufactured by transferring the thin film element (310) formed on a transfer-source substrate (10) to a transfer-destination substrate (70). The method includes the processes of: forming the thin film element on a peeling layer (11) provided on the transfer-source substrate via an insulating film (5); forming an electrode pad (500) on a side above the thin film element on the transfer-source substrate; and forming a shield electrode (710) between the insulating film and electrode pad of a laminate structure on the transfer-source substrate so that the shield electrode overlaps with the electrode pad in plane view on the transfer-source substrate.