Title:
熱硬化性フラックス組成物および電子基板の製造方法
Document Type and Number:
Japanese Patent JP6830935
Kind Code:
B2
Abstract:
To provide a thermosetting flux composition which exhibits an excellent insulation property of a cured material, and excellent solderability even though an activator particle is not contained.SOLUTION: A thermosetting flux composition is used when an electronic component having a solder bump formed of a solder alloy with a melting point of 130-240°C is bonded to an electronic substrate by reflow soldering or thermal compression bonding, and contains (A) an oxetane compound, (B) a liquid carboxyl group-containing compound at a temperature of 20°C. The composition (A) contains a bifunctional oxetane compound having two oxetane rings in one molecule.SELECTED DRAWING: None
Inventors:
Akira Kitamura
Kisei Iijima
Kisei Iijima
Application Number:
JP2018178828A
Publication Date:
February 17, 2021
Filing Date:
September 25, 2018
Export Citation:
Assignee:
TAMURA CORPORATION OF CHINA LIMITED
International Classes:
B23K35/363; C08G65/18; H05K3/34
Domestic Patent References:
| JP2019043992A | ||||
| JP8288630A | ||||
| JP8204327A |
Foreign References:
| WO2017110052A1 |
Attorney, Agent or Firm:
Intellectual Property Office