METHOD OF MANUFACTURING THIN PLATE, PIEZO-ELECTRIC PLATE, AND PIEZO-ELECTRIC VIBRATOR

Title:

METHOD OF MANUFACTURING THIN PLATE, PIEZO-ELECTRIC PLATE, AND PIEZO-ELECTRIC VIBRATOR

Document Type and Number:

Japanese Patent JP2002079457

Kind Code:

A

Abstract:

To work a quartz plate to a thickness of several μm.

The quartz plate QP of a thickness of 100 μm is adhered to a ceramic fixing board 1 by means of an adhesive 2, and the circumference of the quartz plate QP is protected by an iron washer adhered to the fixing board 1. The lapping work is executed on a first face A of the quartz plate QP to a thickness of 60 μm. The quartz plate QP is separated from the ceramic fixing board 1, and the first face A is adhered to a brass fixing board 11 by means of an adhesive 12. A nickel plating film 14 of a thickness 20 μm is formed around the quarts plate QP. The lapping work is executed on a second face B of the quartz plate QP to a thickness of 20 μm. The second face B of the quartz plate QP is polished while supplying the abrasive grain of SiO2 to manufacture the quartz plate QP of a thickness of 5-6 μm.

Inventors:

UEDA NOBORU
TOGE MUTSUMI

Application Number:

JP2000268170A

Publication Date:

March 19, 2002

Filing Date:

September 05, 2000

Export Citation:

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Assignee:

UEDA NOBORU
TOGE MUTSUMI
NIKON CORP

International Classes:

B24B1/00; B24B7/22; B24B37/00; H01L21/304; H03H3/02; (IPC1-7): B24B37/00; H01L21/304

Attorney, Agent or Firm:

Fuyuki Nagai

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