To provide a method of manufacturing a wiring board such that an accurate wiring pattern can be formed at low cost even on a base in a complicated shape.
The wiring board 1 is manufactured by the method of manufacturing the wiring board including: a film forming step of forming an ink-repellent film 31 which repels ink on the base 10; a groove processing step of forming a groove 32 which is deep enough to expose at least a surface of the base 10 in a wiring region 13 where a wiring pattern 34 of the ink-repellent film 31 formed in the film forming step is formed; a dipping step of dipping the base 10 in ink after the groove processing step to stick metal particles in the ink on the wiring region 13; and a baking step of heating the metal particles stuck on the base 10 in the dipping step up to higher than baking temperature for baking.
Masatake Shiga
Suzuki Mitsuyoshi
Tadao Takashiba
Hiroshi Masui