To provide a method for measuring a worked and degenerated layer which can be measured readily, without preparing a plurality of sample pieces, even when the worked and degenerated layer in a plurality of places is measured regarding an object to be worked and to provide a grinding apparatus, which is used to prepare a sample for the measurement of the worked and degenerated layer.
A circumferential groove 18, whose cross-sectional shape is arc-shaped is formed on the surface of a wafer 2 on which the worked and degenerated layer 30, is formed. A length 21 in the X-direction of the worked and degenerated layer 30, which appears on the slope 20 of the circumferential groove 18, is measured. By multiplying the length 21 in the X-direction of the worked and degenerated layer 30 by tan θ as the angle of inclination of the slope 20, a length 22 in the Y-direction of the worked and degenerated layer 30 is measured.
FUKUDA KOJI
MURAI SHIRO
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