To make simple the manufacturing process of mechanical equipment or a wiring board constituted by mounting a bare IC chip on a circuit, by emitting electromagnetic waves upon the bare IC chip from the side opposite to the arranging side of the chip while the chip is press-contacted with a base material.

A circuit 1 is formed on a base material 2, and an insulating adhering section 5 for the terminals 3 of a bare IC chip 3 is formed by printing an insulating adhesive substance B. Then terminal adhering sections 6 are formed in the circuit 1 so that the sections 6 may necessarily come into contact with the terminals 4 of the chip 3, by printing a conductive adhesive substance A until thicknesses of the sections 6 become thicker than that of the section 5. Thereafter, the chip 3 is placed on the base material 2 by aligning the chip 3 with the insulating adhering section 4 and terminal adhering sections 6 and press-contacted with the material 2. While the chip 3 is press-contacted with the material 3, electromagnetic waves are emitted upon the chip 3 from the side opposite to the arranging side of the chip 3. Thus, the chi 3 is mounted on the circuit 1.