Login| Sign Up| Help| Contact|

Patent Searching and Data


Title:
METHOD FOR MOUNTING PRESS DIE, PRESS DIE AND PRESS
Document Type and Number:
Japanese Patent JP2003191029
Kind Code:
A
Abstract:

To perform the mounting work of a press die safely and easily by handwork.

Upper dies are slidably mounted by providing grooved parts 31 on an upper plate 1 which is fixed to the ram 201 of a press and projecting parts 32 which are engaged with the grooved parts on the die set plates 13 of upper dies 11. The lower dies are forced into the lower plate 2, positioned and, after that, fixed with bolts by sliding lower dies 12 on a lower plate 2 which is fixed to the bolster 202 of the press, engaging the notched parts of the die set plates 17 of the lower dies with the 1st positioning pins 41 projected on the lower plate 2 and passing the 2nd positioning pins 51 through the fitting holes of the die set plates 17 of the lower dies.


Inventors:
MACHIDA SEIJI
TAGUCHI YASUHIRO
NOMURA NORIO
Application Number:
JP2001391268A
Publication Date:
July 08, 2003
Filing Date:
December 25, 2001
Export Citation:
Click for automatic bibliography generation   Help
Assignee:
SEIKO EPSON CORP
International Classes:
B21D37/04; B21D37/14; B21D39/02; B30B15/02; (IPC1-7): B21D37/04; B21D37/14; B21D39/02; B30B15/02
Attorney, Agent or Firm:
Muneharu Sasaki (3 outside)



 
Previous Patent: PEENING METHOD

Next Patent: MOLDING METHOD FOR CONCRETE MOLD