Title:
METHOD FOR MOUNTING SEMICONDUCTOR CHIP AND DEVICE THEREFOR
Document Type and Number:
Japanese Patent JPH11204548
Kind Code:
A
Abstract:
To provide a method for mounting a semiconductor chip on a tape automated bonding(TAB) tape without involving bubbles, and a mounting device to be used for this.
A surrounding part of a die attach part 7 is covered with a depressurizing chamber 10, and the mounting of a semiconductor chip on a TAB tape 3 is carried out. The inside part of the depressurizing chamber 10 is sucked and depressurized by a vacuum pump 11, so that bubbles existing between the TAB tape 3 and an adhesive layer or between the adhesive layer and the semiconductor chip are excluded, so that bubble involvement in those parts can be prevented.
Inventors:
SUGA MIYUKI
OKABE NORIO
KAMEYAMA YASUHARU
ONDA MAMORU
OKABE NORIO
KAMEYAMA YASUHARU
ONDA MAMORU
Application Number:
JP299198A
Publication Date:
July 30, 1999
Filing Date:
January 09, 1998
Export Citation:
Assignee:
HITACHI CABLE
International Classes:
H01L21/60; H01L21/52; (IPC1-7): H01L21/52; H01L21/60
Attorney, Agent or Firm:
Tadao Hirata
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