Title:
METHOD OF PATTERNING LAMINATED WIRING
Document Type and Number:
Japanese Patent JP3221373
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To provide a patterning method of oxidizing an exposed face of an aluminum based alloy, after etching a laminated structure whereupon the aluminum based alloy is formed.
SOLUTION: An aluminum based alloy 8b is formed on a first high melting point metal 8a, and the laminated wiring having a second high melting point metal 8c is patterned on the aluminum based alloy 8b. The side of the aluminum based alloy pattern is oxidized by providing a warm water in the cleaning process of the patterning of the second high melting point metal 8c and the aluminum based alloy 8b, and of the peeling process of a resist 9.
Inventors:
Yoko Furucha
Application Number:
JP29187697A
Publication Date:
October 22, 2001
Filing Date:
October 24, 1997
Export Citation:
Assignee:
NEC
International Classes:
G02F1/1343; H01L21/302; H01L21/3065; H01L21/3213; H01L21/336; H01L29/786; (IPC1-7): H01L21/3213; G02F1/1343; H01L21/3065; H01L21/336; H01L29/786
Domestic Patent References:
| JP7249611A | ||||
| JP4240824A | ||||
| JP6312138A | ||||
| JP8111401A |
Attorney, Agent or Firm:
Yoshiyuki Iwasa