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Title:
METHOD OF POSITIONING AND RECEIVING WAFER CASSETTE AND CASSETTE RECEIVER
Document Type and Number:
Japanese Patent JPH05160250
Kind Code:
A
Abstract:

PURPOSE: To bring down a cassette which stores a wafer, guide the wafer from the both sides, suppress contact abrasion powder and accurately position the cassette on a mounting table.

CONSTITUTION: Two fixed guiding rollers 11 are arranged on one of the outer sides of a mounting table 3, a movable guiding roller 12 is arranged on the other outer side so as to permit a spring member 14 to press a cassette in the direction of the fixed guiding rollers 11. A space between the rollers 11 and the roller 12 is set to be slightly smaller than the width of the cassette 1, the descending cassette 1 is positioned by being sandwiched by the guiding rollers 11 and 12 and the cassette is mounted on the mounting table 3.


Inventors:
TANIGUCHI TAKAO
Application Number:
JP35097791A
Publication Date:
June 25, 1993
Filing Date:
December 10, 1991
Export Citation:
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Assignee:
MITSUBISHI ELECTRIC CORP
International Classes:
H01L21/68; H01L21/673; (IPC1-7): H01L21/68
Attorney, Agent or Firm:
Hiroshi Murakami (1 outside)



 
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