Title:
METHOD OF POSITIVELY COOLING ELECTRONIC COMPONENT FIXED ON MULTILAYER BODY FOR PRINTED CIRCUIT AND MULTILAYER BODY REALIZED THEREBY
Document Type and Number:
Japanese Patent JPS61292997
Kind Code:
A
Abstract:
The method ensures the cooling of electronic components (CE) fixed on a multilayer (1), with at least a metal layer (3) interposed between insulating layers (11), through successive steps for the obtaining of seats or cavities (13) or through-holes (31) with metallized surface, the seats or cavities (13) having the bottom formed by said metal layer (3) and the through-holes (31) being formed in the vicinity of the same seats; the cooling of the component (CE) is achieved by heat conduction along said metal layer (3), or by dissipator means (21, 23) located outside the multilayer and in thermal conductivity connection with said metal layer (3).
Inventors:
RENZOO DETOMA BIGURIA
Application Number:
JP13941586A
Publication Date:
December 23, 1986
Filing Date:
June 17, 1986
Export Citation:
Assignee:
MASU IND SPA
International Classes:
H05K1/02; H05K1/18; H05K3/00; H01L23/34; H05K3/46; H05K7/20; H05K1/05; H05K3/34; H05K3/42; H05K3/44; (IPC1-7): H01L23/34; H05K1/18; H05K3/46; H05K7/20
Attorney, Agent or Firm:
Shigeru Yagida