Title:
METHOD FOR PREPARING OBJECT TO BE CUT AND CUTTING DEVICE
Document Type and Number:
Japanese Patent JP2023106278
Kind Code:
A
Abstract:
To provide a method for preparing an object to be cut and a cutting device.SOLUTION: A method for preparing an object to be cut includes the steps of: establishing predetermined orientation information as of when the object to be cut is cut on a stage; acquiring actual azimuth information as of before the object to be cut is transferred onto the stage; calculating an offset value between the actual azimuth information and the predetermined orientation information by a control unit; and adjusting an orientation of the object to be cut or an orientation of the stage on the basis of the offset value so as to place the object to be cut in a state matching the predetermined orientation information before the object to be cut is transferred onto the stage. Thereby, the method can adjust the orientation of the object to be cut during transferring and improves efficiency of cutting operation.SELECTED DRAWING: Figure 2
Inventors:
CHEN BO-YUAN
CAI JIA-YAN
LIN SHI-QI
CAI JIA-YAN
LIN SHI-QI
Application Number:
JP2022068371A
Publication Date:
August 01, 2023
Filing Date:
April 18, 2022
Export Citation:
Assignee:
ALL RING TECH CO LTD
International Classes:
B23Q3/18; B23Q17/22; B23Q17/24; B23Q39/04; B28D1/24
Domestic Patent References:
| JP2013215825A | 2013-10-24 | |||
| JP2020004862A | 2020-01-09 | |||
| JPS61197143A | 1986-09-01 | |||
| JPH1151613A | 1999-02-26 |
Attorney, Agent or Firm:
Tadashige Ito
Tadahiko Ito
Osamu Miyazaki
Tadahiko Ito
Osamu Miyazaki