Title:
METHOD FOR PRODUCING ELECTRONIC PART AND ELECTRONIC PART
Document Type and Number:
Japanese Patent JP2004115902
Kind Code:
A
Abstract:
To provide a plating film which can secure satisfactory solderability even after reflow heating treatment for a plurality of frequencies.
An Ni-P film and an Au film are successively formed on a Cu electrode formed on the surface of a ceramic element assembly through a pretreatment stage 11, an autocatalytic Ni plating stage 12 and a substitution Au plating stage 13. Then, in a posttreatment stage 14, the ceramic element assembly in which the Au film is formed is used as the object to be dried, the object to be dried is fed into a vacuum drying apparatus evacuated at most to ≤13.3 Pa, and vacuum drying treatment is performed to remove moisture remaining on the boundary between the Ni-P film and the Au film.
Inventors:
TAKAOKA HIDEKIYO
OGAWA MAKOTO
HAMADA KUNIHIKO
OGAWA MAKOTO
HAMADA KUNIHIKO
Application Number:
JP2002284805A
Publication Date:
April 15, 2004
Filing Date:
September 30, 2002
Export Citation:
Assignee:
MURATA MANUFACTURING CO
International Classes:
C23C18/52; (IPC1-7): C23C18/52
Attorney, Agent or Firm:
Kunihiro Yasutoshi
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