To provide a method for producing a heat-conductive resin composition, capable of producing the resin composition as inexpensively as possible while dispersing silicon particles free from rough particles in the resin composition.

A method for producing a heat-conductive resin composition includes: a silicon particle production step (silicon wafer processing step) of preparing silicon particles by cutting a silicon ingot into a plurality of thin plates using a wire saw; and dispersing the silicon particles in a resin composition.