Title:
METHOD FOR PRODUCING HEAT-CONDUCTIVE RESIN COMPOSITION
Document Type and Number:
Japanese Patent JP2013227463
Kind Code:
A
Abstract:
To provide a method for producing a heat-conductive resin composition, capable of producing the resin composition as inexpensively as possible while dispersing silicon particles free from rough particles in the resin composition.
A method for producing a heat-conductive resin composition includes: a silicon particle production step (silicon wafer processing step) of preparing silicon particles by cutting a silicon ingot into a plurality of thin plates using a wire saw; and dispersing the silicon particles in a resin composition.
Inventors:
INOUE TOMIO
YANAGIHARA TAKESHI
YANAGIHARA TAKESHI
Application Number:
JP2012111027A
Publication Date:
November 07, 2013
Filing Date:
May 14, 2012
Export Citation:
Assignee:
ADMATECHS CO LTD
International Classes:
C08L101/00; C08K3/02; C01B33/02
Domestic Patent References:
JP2007161965A | 2007-06-28 | |||
JP2009263405A | 2009-11-12 | |||
JP2001278612A | 2001-10-10 | |||
JP2011088805A | 2011-05-06 |
Attorney, Agent or Firm:
Hiroshi Okawa