To provide: a high molecular weight epoxy resin containing high purity bisphenol S with no bromine contained therein; a resin composition containing the high molecular weight epoxy resin; a method for producing the high molecular weight epoxy resin; and the resin composition for a printed circuit board composed of the resin composition.
In the method for producing the high molecular weight epoxy resin of which the weight average molecular weight is 10,000-200,000, a polymerization reaction between a bifunctional epoxy resin (X), of which the concentration of hydrolyzable chlorine is 200 milliequivalent/kg or less and of which the concentration of -glycol group is 100 milliequivalent/kg or less, and a dibasic phenol compound (Y) containing bisphenol S of 70-100 wt.% is conducted in the presence of a catalyst.
FUKUZAWA TAKAO
IMURA TETSURO
ONUMA YOSHINOBU
| JPH06263842A | 1994-09-20 | |||
| JPH06306142A | 1994-11-01 | |||
| JPH09286078A | 1997-11-04 | |||
| JPS61145221A | 1986-07-02 | |||
| JPH055210A | 1993-01-14 | |||
| JP2001181375A | 2001-07-03 |
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