Title:
METHOD FOR MANUFACTURING MULTILAYER WIRING BOARD, KIT FOR FORMING LAMINATE FILM AND COMPOSITION
Document Type and Number:
Japanese Patent JP2022132188
Kind Code:
A
Abstract:
To provide a method for manufacturing a multilayer wiring board that can form an organic film with excellent adhesion to a plating layer on the inner wall surface of a via, and is excellent in metal embedding into the via by plating process.SOLUTION: The method for manufacturing a multilayer wiring board has a first formation process for forming a first organic film 16 on a wiring 13 inside a via 11 formed on an insulating layer 14 provided on the wiring 13, a second formation process for forming a second organic film 17 on the inner wall surface of the via 11 after forming the first organic film 16, a removal process for removing the first organic film 16 after forming the second organic film 17, and a plating process for forming a plating layer 18 inside the via 11 after the first organic film 16 is removed. The second organic film 17 is formed using a polymer (I) having a first functional group that can interact with a group that the insulating layer 14 has on the surface layer, and has a second functional group that can form a bond with the metal in the plating layer 18.SELECTED DRAWING: Figure 1
Inventors:
KOMATSU HIROYUKI
OZAKI YUKI
OZAKI YUKI
Application Number:
JP2022028229A
Publication Date:
September 07, 2022
Filing Date:
February 25, 2022
Export Citation:
Assignee:
JSR CORP
International Classes:
H01L21/768; C23C18/20; H01L21/288
Attorney, Agent or Firm:
Yamada Tsuyoshi
Miho Hirota
Kyoko Hino
Miho Hirota
Kyoko Hino