Title:
ポリアミド樹脂組成物及び成形品の製造方法
Document Type and Number:
Japanese Patent JP7311338
Kind Code:
B2
Abstract:
To provide a polyamide resin composition which is excellent in blow moldability and is excellent in heat aging resistance and chemical resistance when formed into a molded article.SOLUTION: The polyamide resin composition contains (A-1) polyamide 66, (A-2) a polyamide resin other than polyamide 66, and (B) an ethylene-maleic acid derivative random copolymer. The content of an ethylene unit is 85 mass% or more and 97 mass% or less based on the total mass of all the constituent units constituting the ethylene-maleic acid derivative random copolymer (B). The content of one or more maleic acid derivative units selected from the group consisting of maleic acid monoesters, maleic acid diesters, fumaric acid monoesters, fumaric acid diesters and methyl maleic anhydride is 3 mass% or more and 15 mass% or less based on the total mass of all the constituent units constituting the ethylene-maleic acid derivative random copolymer (B).SELECTED DRAWING: None
Inventors:
Hisho Yamada
Ken Amitani
Hiroshi Oyamada
Ken Amitani
Hiroshi Oyamada
Application Number:
JP2019129491A
Publication Date:
July 19, 2023
Filing Date:
July 11, 2019
Export Citation:
Assignee:
ASAHI KASEI KABUSHIKI KAISHA
International Classes:
C08L77/06; C08K3/013; C08K3/08; C08K3/16; C08K3/26; C08K5/092; C08L23/08; C08L77/02
Domestic Patent References:
| JP2004521171A | ||||
| JP2002513434A | ||||
| JP2005527682A | ||||
| JP58201845A | ||||
| JP51143061A |
Attorney, Agent or Firm:
Yasushi Matsunuma
Masato Iida
田▲崎▼ 聡
Ryu Miyamoto
Masato Iida
田▲崎▼ 聡
Ryu Miyamoto
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