To provide a method for producing a more improved polyimide base multi- layer endless tubular film, in relation to dielectric strength properties and electric resistance properties.

Respective processes of the first - the third are successively performed. (A) A first process; An electrical insulating polyamic acid liquid (electrical insulating PA acid liquid) consisting of polyamic acid (PA acid) and an organic solvent (S solvent) or a semiconductive PA acid liquid containing PA acid, conductive carbon black powder (CB powder) and an S solvent is uniformly supplied to the inner face of a rotary drum and heated. Thereby, the PA acid endless tubular film (PA film) of electrical insulation(EI), in which a part of the S solvent remains and is contained, or a semiconduction(SC) is molded. (B) A second process: Semiconductive PA acid liquid having ≥1 Pa.s solution viscosity or the electrical insulating PA acid liquid having ≥1 Pa.s solution viscosity is uniformly supplied to EI of the inside of the rotary drum or to the inner face of the PA film of SC at non-centrifugal force rotating speed and at an atomizing shape and heated and PA acid of SC or EI is laminated and molded. (C) A third process: The laminated PA film is heated by hot air and both removal of the remaining solvent and imidizing are performed. The laminated PA film is used for an intermediate transcription belt.