Title:
ポリイミド系フィルムの製造方法及びこれから製造されたポリイミド系フィルム
Document Type and Number:
Japanese Patent JP7235828
Kind Code:
B2
Abstract:
The present invention relates to a polyimide-based film, wherein the polyimide-based film is useful as a cover substrate for a flexible electronic device since flexure characteristics thereof, represented by yield elongation, are excellent.
Inventors:
Hong, Kyle
John, Haku-Gi
John, Haku-Gi
Application Number:
JP2021172167A
Publication Date:
March 08, 2023
Filing Date:
October 21, 2021
Export Citation:
Assignee:
Kolon Industries Inc.
International Classes:
C08J5/18; B29C55/06
Domestic Patent References:
| JP2017033033A | ||||
| JP2015508345A | ||||
| JP2017186473A | ||||
| JP5169526A | ||||
| JP2015010107A | ||||
| JP2009007500A | ||||
| JP5331287A |
Foreign References:
| KR101729731B1 | ||||
| US20170183462 | ||||
| US20170342224 | ||||
| WO2017150377A1 | ||||
| US20160185926 |
Attorney, Agent or Firm:
Yamashita
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