To provide a method of recording the position data of all semiconductor chips on a substrate whereby the position data is readable from terminals even after assembling them in a package.

Photo resist windows 117 for defining impurity introducing regions are overlapped with part of mutually 90% inclined polycrystal Si resistor 116. The overlapped area varies, depending on the exposing position in a wafer plane. A polycrystal Si resistor pattern for recording the semiconductor chip position is previously formed on a chip of a reduction aligner to thereby record the semiconductor chip position on an exposed wafer.