METHOD FOR REDUCING ADHESIVITY OF MEMS AND DEVICE COATED TO PREVENT ADHESION

Title:

METHOD FOR REDUCING ADHESIVITY OF MEMS AND DEVICE COATED TO PREVENT ADHESION

Document Type and Number:

Japanese Patent JP2005144660

Kind Code:

A

Abstract:

To provide a method for reducing an adhesiveness of MEMS and a MEMS device coated to prevent adhesion is applied.

A method is provided to form a layer for preventing adhesion on a surface of a device, the method comprising the steps of carrying a coating material 24 on a cap wafer 21, and connecting the cap wafer and a MEMS wafer 41, so that both of the wafers form a hollow space, and thereafter coating at least a part of the surface of the MEMS wafer by evaporating the coating material.

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Inventors:

HENNING FRANK
MUELLER LUTZ
HOEFER HOLGER
KAELBERER ARND

Application Number:

JP2004329303A

Publication Date:

June 09, 2005

Filing Date:

November 12, 2004

Export Citation:

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Assignee:

BOSCH GMBH ROBERT

International Classes:

B81C3/00; B81B3/00; B81C1/00; H01L21/00; H01L27/14; H01L29/82; H01L29/84; (IPC1-7): B81C3/00

Attorney, Agent or Firm:

Toshio Yano
Einzel Felix-Reinhard
Reinhard Einsel

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