Title:
METHOD FOR RELEASING DEPOSITED FILM
Document Type and Number:
Japanese Patent JPH1060621
Kind Code:
A
Abstract:
To reduce the damage of a substrate, to shorten the treating time and to improve treating efficiency.
A deposited film 2 formed on the surface of a conductive substrate 1 is released. In this case, the substrate 1 is used as a cathode, gas is generated from the substrate 1 by electrolysis, a corrosive electrolyte 4 is employed for the deposited film 2, a current is applied between the cathode and an anode 6 in an electrolytic cell 5, hence gas is generated in the boundary layer between the substrate 1 and the deposited film 2, and the film 2 is released by the action of the gas.
Inventors:
NAKAMURA TOMONOBU
MATSUI TAISUKE
MATSUI TAISUKE
Application Number:
JP23994496A
Publication Date:
March 03, 1998
Filing Date:
August 23, 1996
Export Citation:
Assignee:
MATSUDA SANGYO KK
International Classes:
C23C14/00; H01L21/205; (IPC1-7): C23C14/00; H01L21/205
Attorney, Agent or Firm:
Kobayashi Toshio (1 person outside)
Previous Patent: THIN TITANIUM SHEET AND ITS PRODUCTION
Next Patent: PRODUCTION OF THIN-FILM INSULATING LAYER
Next Patent: PRODUCTION OF THIN-FILM INSULATING LAYER