Title:
METHOD FOR RELEASING GOLD PLATING
Document Type and Number:
Japanese Patent JPH01132781
Kind Code:
A
Abstract:
PURPOSE:To safely and easily release and recover a gold plating layer by dipping a gold-plated metallic part in molten solder to form the alloy of gold and solder, and then dipping the part in a solder releasing soln. CONSTITUTION:A printed-wiring board 1 having sucessively a pattern copper 5, a nickel plating layer 6, and a gold plating layer 7 on the board 4 is dipped in the molten solder 10 in an alloying tank to deposit the solder 10 on the gold plating layer 7, and the layer of the alloy of gold and solder is formed at the interface between the gold plating layer 7 and the solder 10. The board is dipped in the solder releasing soln. 11 to dissolve the gold plating layer 7, Ni plating layer 6, and solder layer 10, and the gold plating layer 7 is released from the pattern copper 5 along with the Ni plating 6. The gold plating layer 7 is safely released and recovered without using a highly toxic cyanide which is used in the conventional method.
Inventors:
FUJII TASUKU
NISHIDA SHOICHI
NISHIDA SHOICHI
Application Number:
JP28988387A
Publication Date:
May 25, 1989
Filing Date:
November 17, 1987
Export Citation:
Assignee:
MITSUBISHI ELECTRIC CORP
International Classes:
C23F1/44; H05K3/06; H05K3/22; H05K3/24; (IPC1-7): C23F1/44
Attorney, Agent or Firm:
Masuo Oiwa (2 outside)
Previous Patent: SURFACE TREATMENT OF SUBSTRATE AND DEVICE THEREFOR
Next Patent: YNL 075W/HTXFT 19 POLYNUCLEOTIDE AND POLYPEPTIDE
Next Patent: YNL 075W/HTXFT 19 POLYNUCLEOTIDE AND POLYPEPTIDE