Title:
METHOD FOR SOLDERING CHIP
Document Type and Number:
Japanese Patent JP3492826
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To provide a method for soldering a chip for eliminating the chip moved up by the unbalance of the melting speed of cream solder.
SOLUTION: Cream solder 3 is applied to the inner edge part of a land 2 of a substrate 1 and an electrode 6 is landed on the cream solder 3 and a chip 4 is mounted. A mold body 5 of the chip 4 is adhered to the cream solder 3 on the land 2. The substrate 1 is heated by a heating oven, the cream solder 3 is melted, and the chip 4 is soldered. In this case, even if the melting speed of the left and right cream solder 3 is different, the chip 4 cannot be moved up due to the surface tension of the previously melted cream solder 3 since the mold body 5 is adhered onto the land 2 by the cream solder 3.
Inventors:
Ken Maeda
Application Number:
JP24112795A
Publication Date:
February 03, 2004
Filing Date:
September 20, 1995
Export Citation:
Assignee:
Matsushita Electric Industrial Co., Ltd
International Classes:
H05K3/34; (IPC1-7): H05K3/34
Domestic Patent References:
| JP4151893A | ||||
| JP66021A | ||||
| JP373393A | ||||
| JP33391A | ||||
| JP63284891A | ||||
| JP350400U |
Attorney, Agent or Firm:
Fumio Iwahashi (2 others)
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