PURPOSE: To improve positional accuracy in bonding covers to electronic components, by forming slits in carrier and support tapes with a cover tape interposed between them, and then peeling off the support and cover tapes with covers left on the carrier tape.

CONSTITUTION: An adhesive layer 5 is applied and dried on the lower face of a carrier tape 2 while an adhesive layer 6 is applied and dried on the lower face of a cover tape 3. Slits 8 are formed from the top face of the carrier tape 2 by means of a cutting tooth form. Extent of descending the cutting tooth form is adjusted such that it passes through the carrier tape 2 and cover tape 3 and penetrates into a support tape 4 a little. A series of covers are then reversed so that the support tape 4 is on the top side. Slits 9 are formed from the top of the support tape 4 by means of the cutting tooth form in a similar manner to the slits 8. The ends 3' of the support tape 4 and cover tape 3 are pulled down to peel them off. Electronic components 12 are raised up to the level of the covers 10 and pressed against the adhesive layers 11 so that they are bonded together.