Title:
METHOD FOR SURFACE PROTECTION DURING ETCHING
Document Type and Number:
Japanese Patent JP3265656
Kind Code:
B2
Abstract:
PURPOSE: To protect the surface of a body to be treated by sticking a radiation- curable adhesive tape on an area not to be etched, irradiating the adhesive layer of the tape with radiation for curing thereof and then subjecting the body to etching treatment.
CONSTITUTION: In an etching process of a plate material, the area not to be etched is coverd with a radiation-curable adhesive tape to protect the surface. Etching resistance is given to the plate material by preliminarily curing the radiation-curable adhesive layer of the tape by irradiation, then etching is performed, and the adhesive tape is peeled from the plate material. Thereby, the plate material shows improved acid resistance against an etching soln. and decreased water absorption and has etching resistance.
Inventors:
Shinichi Ishiwatari
Kazushige Iwamoto
Michio Ueyama
Isamu Noguchi
Kazushige Iwamoto
Michio Ueyama
Isamu Noguchi
Application Number:
JP31431192A
Publication Date:
March 11, 2002
Filing Date:
October 30, 1992
Export Citation:
Assignee:
THE FURUKAW ELECTRIC CO.,LTD.
International Classes:
C23F1/00; H01L21/306; (IPC1-7): C23F1/00; H01L21/306
Domestic Patent References:
| JP63213684A | ||||
| JP5591127A |
Attorney, Agent or Firm:
Toshizo Iida
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