To improve stability and reliability when forming asperity on the surface of a substrate used for a solar cell, and so on.

In an etching method, the surface of a substrate carried in an etching chamber is roughened by performing dry etching by introducing an etching gas in a state where the surface of the substrate is covered with a plate member through which many openings are formed and the inside of the etching chamber is evacuated. Before the inside of the etching chamber is evacuated, the plate member is cleaned.