PURPOSE: To execute the humidity resistance test of a resin-sealed type semiconductor device in a short time with high reproducibility, by setting temp. of steam atmosphere to not lower than a specified value, and bias nonapplication time to a time length not shorter than the time within which moisture can reach the surface of said device chips.
CONSTITUTION: Resin-sealed type semiconductor devices 1 are placed in a sample vessel 6 located in a thermostat 7, and terminals 10 fixed to the vessel 6 are connected to sockets fixed to insulating bases so as to apply bias. A heater 9 is installed on the outside of the vessel 6, and on the other hand, steam is fed through a pipe 8 by evaporating water 4 in a steam generating vessel 2 with a heater 3. The vessel 6 is maintained at ≥100°C and a constant humidity (≥85%), and bias nonapplication time is set to ≥10hr within which moisture can thorougly reach the surface of the chips of the devices 1, and bias application time is set,e.g. to 8hr, and a cycle of, e.g. 24hr is repeated, thus a humidity resistance test can be executed in a time shorter than the continuous bias application test, and further, reproducibility is enhanced.
TAKAHASHI MINORU
UEKI TAKEMI
NOYORI MASAHARU
HIGUCHI HIROSHI
MATSUSHITA ELECTRIC IND CO LTD