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Title:
METHOD OF TRANSPORTING BOARD, AND ELECTRONIC PARTS MOUNTER
Document Type and Number:
Japanese Patent JP2001094290
Kind Code:
A
Abstract:

To provide a board transporting method, which can suppress the dislocation of electronic parts from a circuit board pattern at the time of transporting the board and prevent the occurrence of the board inferiority such as short circuit, etc., and an electronic parts mounter, and materialize the speed up of the electronic parts mounting process.

In the board transporting method of an electronic part mounter 31 which mounts electronic parts 9 on transported-in board 3 and transports it, this method consists of the first process of transporting in the board 3, the second process of mounting the electronic parts 9 on this board 3, and the third process of transporting out the board 3 whereon the electronic parts 9 are mounted, and the speed and acceleration of the board 3 in the third process where the electronic part 9 is not mounted are made lower than those of the board 3 in the first process where the electronic part 9 is not mounted.


Inventors:
NAGASAWA YOSUKE
SANO TOMONORI
NISHIMORI YUZO
Application Number:
JP26751899A
Publication Date:
April 06, 2001
Filing Date:
September 21, 1999
Export Citation:
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Assignee:
MATSUSHITA ELECTRIC IND CO LTD
International Classes:
H05K13/02; (IPC1-7): H05K13/02
Attorney, Agent or Firm:
Tadashi Hagino (4 outside)