Login| Sign Up| Help| Contact|

Patent Searching and Data


Title:
三次元構造体の貫通流路を研磨するための方法およびデバイス
Document Type and Number:
Japanese Patent JP6741977
Kind Code:
B2
Abstract:
Provided is a method for polishing a through flow passage with which it is possible to polish a through flow passage in a three-dimensional structure more appropriately without using a cylinder. In this method, a through flow passage is subjected to a polishing process by causing a polishing fluid including abrasive particles and a liquid to flow through the through flow passage from a sealed container loaded with the polishing fluid. Particularly, in the sealed container, a dispersion process is performed wherein bubbles are created in the polishing fluid to disperse the abrasive particles in the liquid.

Inventors:
Shinya Watanabe
Satoshi Abe
Kenichi Tanaka
Uchinono Yoshiyuki
Mikio Mori
Kento Ohara
Morimoto Masanori
Satoshi Nakamura
Application Number:
JP2016103331A
Publication Date:
August 19, 2020
Filing Date:
May 24, 2016
Export Citation:
Click for automatic bibliography generation   Help
Assignee:
Panasonic IP Management Co., Ltd.
International Classes:
B24B31/00
Domestic Patent References:
JP2005059115A
JP2007260831A
JP8099261A
JP5115713A
JP2002224958A
JP2012035353A
JP62136211U
JP2011067902A
Attorney, Agent or Firm:
Samejima Mutsumi
Haruhiko Ema



 
Previous Patent: 板状建材

Next Patent: 照明器具