Title:
三次元構造体の貫通流路を研磨するための方法およびデバイス
Document Type and Number:
Japanese Patent JP6741977
Kind Code:
B2
Abstract:
Provided is a method for polishing a through flow passage with which it is possible to polish a through flow passage in a three-dimensional structure more appropriately without using a cylinder. In this method, a through flow passage is subjected to a polishing process by causing a polishing fluid including abrasive particles and a liquid to flow through the through flow passage from a sealed container loaded with the polishing fluid. Particularly, in the sealed container, a dispersion process is performed wherein bubbles are created in the polishing fluid to disperse the abrasive particles in the liquid.
Inventors:
Shinya Watanabe
Satoshi Abe
Kenichi Tanaka
Uchinono Yoshiyuki
Mikio Mori
Kento Ohara
Morimoto Masanori
Satoshi Nakamura
Satoshi Abe
Kenichi Tanaka
Uchinono Yoshiyuki
Mikio Mori
Kento Ohara
Morimoto Masanori
Satoshi Nakamura
Application Number:
JP2016103331A
Publication Date:
August 19, 2020
Filing Date:
May 24, 2016
Export Citation:
Assignee:
Panasonic IP Management Co., Ltd.
International Classes:
B24B31/00
Domestic Patent References:
JP2005059115A | ||||
JP2007260831A | ||||
JP8099261A | ||||
JP5115713A | ||||
JP2002224958A | ||||
JP2012035353A | ||||
JP62136211U | ||||
JP2011067902A |
Attorney, Agent or Firm:
Samejima Mutsumi
Haruhiko Ema
Haruhiko Ema