Title:
植物繁殖素材をコーティングするための方法及び組成物
Document Type and Number:
Japanese Patent JP2008521816
Kind Code:
A
Abstract:
The present invention provides a process for coating a plant propagation material, including a seed, comprising: a.) providing a propagation material, such as seed, to be coated; b.) applying to the propagation material a composition comprising at least one reactant having reactive functionality and, optionally, at least one active ingredient; and c.) polymerising, crosslinking, curing or otherwise reacting the reactant having reactive functionality on the surface of the plant propagation material to form a coating thereon which may encompass an a.i., when present. The present invention further provides a method for enhancing the safety, quality and/or viability of a plant propagation material, including a seed, comprising providing a coated material having less dust-off.
Inventors:
Butterfly,victor
Alan Nelson
Beres, Jack Lean
Alan Nelson
Beres, Jack Lean
Application Number:
JP2007543504A
Publication Date:
June 26, 2008
Filing Date:
November 23, 2005
Export Citation:
Assignee:
Syngenta Partitions Akchen Gesell Shaft
International Classes:
A01N63/02; A01C1/06; A01N25/00; A01N43/36; A01N43/54; A01N51/00; A01P3/00; A01P7/04
Domestic Patent References:
JPH0322905A | 1991-01-31 | |||
JP2005520564A | 2005-07-14 | |||
JP2002538792A | 2002-11-19 | |||
JPS63222603A | 1988-09-16 | |||
JPH046191A | 1992-01-10 | |||
JP2003286106A | 2003-10-07 | |||
JP2002532390A | 2002-10-02 |
Foreign References:
US2986840A | 1961-06-06 |
Attorney, Agent or Firm:
Atsushi Aoki
Takashi Ishida
Fukumoto product
Tetsuji Koga
Tatsunori Ikeda
Takashi Ishida
Fukumoto product
Tetsuji Koga
Tatsunori Ikeda