Title:
斜めストライプを有するパワーグリッド構造を形成するための方法及び装置
Document Type and Number:
Japanese Patent JP2007525821
Kind Code:
A
Abstract:
A method for defining and producing a power grid structure of an IC having diagonal power and ground stripes. Stripes are placed in a 45° or 135° diagonal direction in relation to an IC layout's x-coordinate axis so that the stripes will be placed in a 45° or 135° diagonal direction, respectively, in relation to the bottom boundary of the resulting IC. The diagonal power and ground stripes are beneficial to diagonal signal wiring. The stripes may be placed across one layer of the IC or across more than one layer of the IC. The diagonal power stripes may have varying widths and/or varying spacing widths on a layer of the IC. The diagonal ground stripes may have varying widths and/or varying spacing widths on a layer of the IC.
Inventors:
Shu Henfu
Tea stephen
Fujimura Akira
Tea stephen
Fujimura Akira
Application Number:
JP2006514871A
Publication Date:
September 06, 2007
Filing Date:
May 13, 2004
Export Citation:
Assignee:
Cadence Design Systems, Inc.
International Classes:
H01L21/82; G06F9/45; G06F17/50; H01L21/3205; H01L21/822; H01L23/52; H01L23/528; H01L27/04; H01L
Domestic Patent References:
| JP2000082743A | 2000-03-21 | |||
| JP2001338982A | 2001-12-07 |
Attorney, Agent or Firm:
Sadao Kumakura
Fumiaki Otsuka
Takaki Nishijima
Hiroyuki Suda
Fumiaki Otsuka
Takaki Nishijima
Hiroyuki Suda