Title:
指紋の構造を測定する方法および装置
Document Type and Number:
Japanese Patent JP4051093
Kind Code:
B2
Abstract:
This invention relates to a method for the measuring of structures in a fingerprint or the like, comprising the measuring of chosen characteristics of the surface of the fingerprint using a sensor array comprising a plurality of sensors, being positioned in contact with, or close to, a portion of the surface, comprising measuring of said characteristics in at least one line of measuring points along an elongated portion of the surface at chosen intervals of time, the sensor array being an essentially one-dimensional array, moving the surface in relation to the sensor array in a direction perpendicular to the sensor array, so that the measurements are performed at different, or partially overlapping, portions of the surface, and calculating said movement. The chosen intervals of time are sufficiently short so as to ensure overlapping measuring points in the direction of the movement when said movement is below a chosen velocity relative to the sensor, and from said measured movement and said measuring points calculating a set of essentially non-overlapping lines of measuring points. The set of non-overlapping lines of measuring points being to provide a segmented, two-dimensional representation of said characteristics of the surface.
Inventors:
Toshdy, Yong
Application Number:
JP50422399A
Publication Date:
February 20, 2008
Filing Date:
June 12, 1998
Export Citation:
Assignee:
SINTEF
International Classes:
G01B7/28; G06T1/00; A61B5/117; G06K9/00
Domestic Patent References:
| JP8287240A | ||||
| JP8154921A | ||||
| JP9231346A |
Attorney, Agent or Firm:
Hideto Asamura
Hajime Asamura
Yutaka Yoshida
Yukio Iwamoto
Hajime Asamura
Yutaka Yoshida
Yukio Iwamoto